Use this directory to find RFPCB.org guides to Rogers circuit materials and related product families. Start with the material system and application, then review the exact grade, thickness and copper construction. The PCB materials guide provides another route into the individual material pages.
RF and microwave laminate families
| Family | Material overview | RFPCB.org guides |
|---|---|---|
| RO3000 | Ceramic-filled PTFE circuit materials for RF and microwave designs. | RO3003; RO3003G2; RO3006 and RO3010 |
| RO4000 | Hydrocarbon ceramic circuit materials; select the core and bonding system together. | RO4003C; RO4350B; LoPro options |
| RT/duroid | Filled PTFE laminates; reinforcement and thermal properties depend on grade. | 5870; 5880; 6002 |
| AD Series | High-frequency circuit laminate grades with distinct constructions. | AD250C; AD255C; AD350A |
| CLTE Series | PTFE composites containing woven glass and ceramic filler. | CLTE-AT; CLTE-MW; CLTE-XT |
| CuClad | Woven-fiberglass-reinforced PTFE circuit laminates. | CuClad 217; CuClad 233; CuClad 250 |
| IsoClad | PTFE laminates reinforced with nonwoven fiberglass. | IsoClad 917; IsoClad 933 |
| TMM | Thermoset microwave laminates offered in several dielectric grades. | TMM 3; TMM 6; TMM 10; TMM 10i |
| TC Series | PTFE, woven-glass and ceramic-filled materials developed for thermal management. | TC350 and TC600 overview; TC350 Plus |
| XtremeSpeed RO1200 | Low-dielectric-constant laminates and bondplys for high-speed designs. | RO1200 series guide |
These family descriptions follow the Rogers Advanced Electronics Solutions product directory. Consult the individual manufacturer’s data sheet for the exact material construction and test conditions.
Bonding materials, printable dielectrics and power interconnects
- Multilayer bonding: Explore RO4400/RO4400T bondply, CuClad 6250 and CuClad 6700 bonding films. Specify the bonding material separately from the laminate core and confirm a compatible lamination process.
- Printed RF dielectric parts: Radix Printable Dielectric is a UV-curable material for photopolymer printing of components such as antenna lenses. See the official Radix overview.
- Power distribution: ROLINX Easy, ROLINX Flex and ROLINX Thermal belong to Rogers’ ROLINX busbar portfolio.
Prepare a material selection or quotation request
Compare materials at the intended frequency and include dielectric loss, dielectric-constant tolerance, thermal expansion, copper roughness and the board’s physical construction. A shared family name does not establish interchangeability between grades. Confirm the specified grade, thickness, copper and processing route with the fabricator before releasing the design.
For a PCB project, send the drawings, stackup, operating frequency, impedance requirements and quantity through the quotation form. Identify any permitted material alternatives explicitly so the engineering review can assess them against the same requirements.
Ready for a quotation?
Send your requirements for a material, stackup and manufacturing review. Price and schedule are confirmed for your project.