Rogers, Taconic, Arlon, Isola, Panasonic Megtron, Wangling F4B, Shengyi and pure PTFE. 2 to 40 layers, hybrid stackups, Dk 2.17 to 10.2. Antenna, 77 GHz radar, 5G mmWave, power amplifier and satcom boards, from 5-piece prototype to volume production.
Reply within 4 working hours, NDA on request
Released process capability verified on RF laminates, not copied from an FR4 datasheet.
| Layer count | 1 - 40 layers |
| Board thickness | 0.10 - 6.00 mm |
| Min line width / spacing | 0.075 / 0.075 mm |
| Min mechanical drill | 0.15 mm |
| Laser via (HDI) | 0.075 mm |
| Copper weight | 0.5 oz - 20 oz |
| Aspect ratio | up to 16 : 1 |
| Max panel size | 600 x 1200 mm |
| Hybrid stackup | PTFE + FR4 + bondply |
| PTFE pre-treatment | Plasma + sodium etch |
| Impedance tolerance | +/-5% (standard +/-10%) |
| Copper foil | ED / RTF / VLP / HVLP |
| Surface finish | ENIG, ENEPIG, ImAg, hard gold, OSP |
| Cavity / step / back-drill | Supported |
| Edge plating / castellated | Supported |
| Standards | IPC-6012 Class 2 / 3 / 3A |
In-stock laminates with full thickness and copper-weight options, plus verified lower-cost equivalents.
FR4-compatible processing. The all-round choice for antennas, 5G and repeaters.
Specs and stackup
Lower loss than RO4350B. Ideal for LNA, filters and low-noise front ends.
Specs and stackup
Very stable Dk over temperature. The 77 GHz automotive radar standard.
Specs and stackup
Lowest-loss PTFE. Satcom, space and mmWave test fixtures.
Specs and stackup
High Dk for miniaturised antennas and size-critical RF modules.
Specs and stackup
Cost-optimised antenna grade for base-station and IoT volume builds.
Specs and stackup
Thick low-loss PTFE for base-station antenna arrays and feed networks.
Specs and stackup
Thermally conductive PTFE, 1.24 W/mK, for high-power RF amplifiers.
Specs and stackupEach page lists the recommended laminate, a proven stackup and the DFM traps we see most often.
Patch, array, GPS, Wi-Fi 6E and 7, with tight Dk and etch-factor control.
RO4350B, RF-35, F4BM
Low Dk drift, HVLP copper, laser-drilled transitions, +/-3% thickness.
RO3003, Astra MT77
Heavy copper, thermal vias, copper-coin heat paths, 1.24 W/mK laminates.
TC350, 92ML, AD255C
Hybrid Rogers plus FR4 stackups, back-drill, controlled loss budget.
RO4003C, Megtron 7
16 to 40 layers, blind and buried vias, +/-5% impedance across panel.
Multilayer PTFE hybrid
Class 3A, full traceability, coupon and cross-section with every lot.
RT/duroid 5880, 6002The RF utilities engineers actually keep in their bookmarks.
Microstrip, stripline, coplanar and differential, with real laminate Dk presets.
Open tooldB per inch versus frequency including copper roughness: ED, RTF, VLP, HVLP.
Open tool MOST USEDEnter any Rogers grade and get verified Taconic, Arlon and F4B equivalents with a cost index.
Open toolDownloadable RF stackups: 4L RO4350B 50 ohm, 6L hybrid, 2L RO3003 77 GHz.
Open toolGerber, ODB++ or IPC-2581. NDA signed first whenever you ask.
Stackup, impedance model, etch compensation and a written risk list.
Itemised cost drivers so you can optimise before you order.
You approve stackup and impedance before production starts.
Plasma and sodium etch, lamination, TDR, AOI, cross-section.
DHL or FedEx in 3 to 5 days with CoC and full test data.
Yes, it is one of our core processes. We bond RO4350B, RO4003C or RO3003 to FR4 or Megtron cores with Rogers 2929 bondply, CuClad or prepreg, from 4 to 20 layers, with matched CTE and pressed-thickness control. See hybrid stackup capability.
Often yes. Depending on frequency and loss budget, Taconic RF-35, Arlon AD350A, Wangling TP-2 or F4BM and Shengyi S7136 can replace RO4350B at 30 to 60 percent lower material cost. Use the cross-reference tool.
No MOQ for prototypes, 5 pieces is fine. Prototype lead time is 3 to 5 working days for 2 to 4 layer RF boards and 7 to 10 working days for multilayer hybrid builds. Full lead-time table.
Yes. Tick the NDA box in the RFQ form and we return a signed NDA within one business day, before any file is opened. Read our NDA policy.
Yes, VNA measurement up to 40 GHz on coupons or on your actual panel, delivered as an S-parameter file plus a PDF report. See quality and reports.
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Read articleSend your Gerber, ODB++ or IPC-2581 package. Within four working hours you receive a price, a recommended stackup, an impedance model and a written DFM review. If a lower-cost laminate meets your loss budget, we quote both.
Upload your files, reply within 4 working hours
No account needed. Reply within 4 working hours, including a lower-cost laminate option if one exists.
