Rogers CuClad 233 is a woven-fiberglass-reinforced PTFE circuit laminate. Its construction uses a medium fiberglass-to-PTFE ratio within the CuClad family, balancing electrical properties with dimensional stability. Rogers uses cross-plied construction to address in-plane material behavior.
CuClad 233 is used for high frequency printed circuitry, including microwave transmission structures and antennas. The material name identifies a dielectric grade, not a finished board with a guaranteed operating frequency or insertion loss.
Rogers distinguishes process dielectric constant from design dielectric constant in its product information. Use the appropriate value with the stated test method, frequency and construction when determining trace geometry. Avoid combining values from different revisions or presenting typical material data as guaranteed performance of an assembled circuit.
Review the current CuClad data sheet for available thickness and copper options. The PTFE construction requires suitable drilling, hole preparation and metallization. A multilayer board also needs a compatible bonding system and a reviewed press process. Specify the exact grade rather than a generic CuClad family reference.
Selection and validation
Before releasing a board, record the exact material designation, dielectric thickness, copper foil, finished stackup and inspection requirements. Have the fabricator review the construction and confirm material availability. Prototype measurements should establish whether the finished circuit meets its electrical and environmental requirements.
Official sources: Rogers CuClad 233 product information; Rogers CuClad laminate data sheet.
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