Material guide • Cost planning • RF design tools
Rogers RO4350B PCB combines a glass-reinforced hydrocarbon/ceramic laminate with practical RF fabrication options. Compare material properties, estimate manufacturing cost, and explore your transmission-line geometry before requesting a reviewed quotation.
For antennas, RF front ends, microwave circuits and mixed RF/digital assemblies. Final material selection depends on your loss budget, stackup and operating conditions.
*Reference values, not finished-board acceptance limits. See the material notes and manufacturer sources below.
What is a Rogers RO4350B PCB?
A Rogers RO4350B PCB is a printed circuit board that uses RO4350B laminate for one or more dielectric layers. It may be a simple two-layer RF board, an all-Rogers multilayer construction, or a hybrid board combining selected RF layers with FR-4. The material name alone does not define the finished thickness, copper profile, bonding system or impedance tolerance. Those details belong in the approved fabrication stackup.
Engineers consider this material when transmission-line loss, phase consistency and repeatable RF behavior matter more than the lowest laminate purchase price. Buyers also need a manufacturable design: a practical panel layout, available core thicknesses, a clear surface-finish requirement and a realistic inspection plan. This page brings those engineering and purchasing decisions together so that an early estimate can become a useful fabrication request.
RO4350B material specifications and design notes
The values below summarize manufacturer reference data. Always check the current datasheet for the exact laminate thickness, foil option and test method on your purchase specification. Material measurements and the effective dielectric constant of a fabricated transmission line are different quantities.
| Property | Reference | How to use it |
|---|---|---|
| Material family | Glass-reinforced hydrocarbon/ceramic | A thermoset RF laminate; do not treat it as a PTFE processing recipe. |
| Process dielectric constant | 3.48 ± 0.05 | Manufacturer process-control reference. Thickness-specific exceptions exist; consult the datasheet. |
| Design dielectric constant | 3.66 | A starting reference for circuit modeling; confirm the model appropriate to your construction. |
| Dissipation factor | 0.0037 at 10 GHz | Typical dielectric-loss reference; total line loss also includes conductor and other effects. |
| Thermal conductivity | 0.69 W/m·K | Include the copper, vias and interface materials in a complete thermal design. |
| Flammability | UL 94 V-0 laminate rating | A laminate rating is not a certification of the completed assembly. |
Primary reference: Rogers RO4350B laminate product data and the RO4000 series datasheet.
Rogers RO4350B PCB cost calculator
Use the interactive configurator below to explore a preliminary manufacturing budget. RO4350B is selected by default. Enter board size, quantity and layer count. Compare one change at a time so that you can identify what drives the estimate. The displayed per-board amount excludes the separately listed NRE/tooling charge; divide the total estimate by quantity to obtain the effective unit cost. Finish, special tests and delivery require a separate review. The tool is a planning aid; its prices are not a binding quotation or evidence of current laminate stock.
What determines RO4350B PCB cost?
A useful cost model separates material allocation, fabrication operations, surface finishing, inspection, setup and delivery. Small orders often carry a higher unit price because engineering and setup are spread across fewer accepted boards. Larger quantities can improve that allocation, but yield, additional panels and inspection requirements still affect the result. Shipping, duties, assembly and specialized RF testing should be identified separately in the formal quotation.
Board dimensions influence panel utilization as well as raw area. A small change to the outline can sometimes improve the number of boards per production panel; in other cases, routing channels, tooling rails, coupons or assembly clearances prevent that improvement. Ask for a panel review before changing the product enclosure. An attractive area-based estimate does not prove that the same number of good boards will fit the factory panel.
A hybrid stackup may reduce expensive RF laminate volume, but it also introduces bonding and construction decisions. Compare the total finished-board quotation, including the lamination plan and inspection, rather than applying a fixed percentage discount to material price. Tight tolerances, small drilled holes, sequential processing and demanding acceptance criteria can outweigh laminate savings.
How to make the estimate actionable
- Record dimensions in the stated units and distinguish single-board size from supplied panel size.
- Enter the purchase quantity and note whether it means individual boards or assembly panels.
- Specify which dielectric layers must be RO4350B and which may use another approved material.
- Save your chosen assumptions in the RFQ, together with the revision of the fabrication files.
- Request confirmation of stock, included tests, delivery terms and price validity before placing an order.
For a reviewed price, use the RF PCB quotation form. Include alternatives you are willing to evaluate, such as a different finished thickness or a longer delivery window. Keeping the electrical requirements fixed while comparing manufacturing options produces a more meaningful cost discussion.
RO4350B impedance design calculator
Start with the microstrip tool for an outer-layer signal over a continuous reference plane. Enter dielectric height, trace width and a suitable dielectric constant in the units shown. This simplified tool does not include a copper-thickness input; confirm finite copper thickness separately. The dielectric height is the distance to the reference plane; it is not automatically the total finished PCB thickness. Changing that height while keeping trace width constant changes the impedance.
Turn a calculator result into a fabrication requirement
A calculated impedance is an initial estimate, not an automatically approved trace width. State the target impedance and tolerance on the drawing, identify the controlled nets and layers, and ask the fabricator to confirm the final geometry using its process assumptions. Decide whether proposed line-width adjustments require your approval. This prevents an ambiguous handoff between the layout file and manufacturing engineering.
Check solder-mask coverage, etched trace shape, final copper thickness and the actual dielectric construction. Connector launches, bends, plane discontinuities and vias can introduce reflections even when a straight line is nominally correct. A microstrip calculator does not solve a grounded coplanar waveguide, a differential pair or a complex transition unless that geometry is explicitly supported. Use the correct solver and electromagnetic analysis for critical structures.
For acceptance planning, specify the coupon construction, measurement method and reporting requirement. A TDR impedance report answers a different question from an insertion-loss or antenna measurement. Review our controlled-impedance RFQ checklist when preparing those requirements, and ensure the test structure represents the production stackup.
Plan a two-layer or hybrid RO4350B stackup
The planner below helps organize a proposed layer arrangement. Treat its output as a discussion draft. A fabrication-ready stackup also needs exact dielectric products, pressed thicknesses, foil specifications, copper weights, bonding materials and tolerance notes. Confirm these details before routing narrow impedance-controlled features or committing the board thickness to a mechanical design.
Two-layer RF construction
A simple starting concept places RF traces and components on the top copper and a largely uninterrupted ground reference on the opposite side of one RO4350B core. This can make the RF path easier to inspect and model. The layout still needs an intentional return path, connector grounding and thermal management. Do not split the reference plane beneath a sensitive line to accommodate an unrelated routing convenience.
Hybrid multilayer construction
A hybrid concept reserves the specified RF dielectric for sensitive signal layers while using a suitable FR-4 system elsewhere for digital routing or power distribution. A common design discussion begins with an outer RF layer referenced to a nearby ground plane, then adds the remaining functional layers around that requirement. The final construction must be reviewed for symmetry, bonding compatibility, overall thickness and manufacturing sequence.
Review hybrid stackup planning notes and the multilayer construction requirements above when your design combines RF and digital functions. Ask for an approved layer-by-layer drawing instead of relying on a material label in an email. Keep the approved stackup revision with the Gerber release so purchasing and engineering refer to the same build.
RO4350B vs FR-4 and other Rogers laminates
Choose the material against measurable circuit requirements. There is no universal frequency at which every RO4350B design becomes unsuitable. Line length, allowed loss, phase error, power, copper roughness and the rest of the RF path all influence the decision. Compare complete constructions under the same assumptions instead of ranking laminates by a single headline number.
| Option | When to investigate | Decision to verify |
|---|---|---|
| RO4350B | RF performance with a practical thermoset fabrication route | Loss budget, foil choice, exact dielectric thickness and laminate rating |
| FR-4 | Cost-sensitive functions with less demanding transmission paths | The particular FR-4 grade and its electrical model, not just the family name |
| RO4003C | Another RO4000-series candidate | Electrical differences and flame-rating requirements; it is not an automatic substitute |
| RO3003 | Designs requiring a different low-loss material system | Geometry, processing and qualification changes |
| RT/duroid 5880 | Applications considering a low-Dk PTFE-based alternative | Mechanical behavior, fabrication details and redesign effort |
A substitution can change line widths, resonator dimensions and connector behavior. Approve alternative materials through engineering rather than accepting a generic “equivalent Rogers” description. If cost reduction is the goal, compare a selective hybrid construction as well as a full material change; the less disruptive option may preserve an already validated RF layout.
Applications and manufacturing review
For an antenna PCB, define the operating band, feed geometry, mounting conditions and measurement setup. Enclosures, cables and nearby metal may shift the result, so prototype validation should represent the installed product. Material consistency helps, but a laminate specification alone cannot guarantee antenna bandwidth, efficiency or radiation pattern.
For RF front ends and power-amplifier boards, examine both the signal and heat paths. Ground connections, thermal vias, copper distribution and the mechanical interface should be reviewed together. A thermally conductive laminate value does not describe junction temperature. Include relevant assembly and heatsink assumptions when asking for manufacturing advice.
Discuss the surface finish for RF circuits alongside assembly needs, storage conditions and electrical performance. Specify where solder mask is permitted, how contact areas are finished and which dimensions need inspection. Material traceability, electrical test and special RF measurements should be explicit purchase requirements rather than assumptions inferred from a product photograph.
Rogers RO4350B PCB FAQs
How much does a Rogers RO4350B PCB cost?
There is no reliable single price per board without dimensions, quantity and construction. Use the cost configurator for a preliminary comparison, then submit fabrication files for a quotation that identifies material, processing, testing and delivery assumptions. A small prototype and a repeated production order can have very different unit costs.
Can RO4350B be combined with FR-4?
Yes, a hybrid construction can use RO4350B for selected RF dielectric layers and a suitable FR-4 system elsewhere. Bonding materials, layer balance and the lamination process need engineering approval. Specify the exact RF layers so the quotation does not accidentally describe a different construction.
Does 3.48 or 3.66 give the correct impedance?
Neither value alone guarantees the result. Process Dk and design Dk come from different characterization conventions. Choose an appropriate material model, include actual geometry and process details, and validate critical lines with the fabricator and representative measurements.
Can I use the calculator result directly in production?
Use it to explore design sensitivity and prepare a clear request. Production geometry must be reconciled with the approved stackup, copper thickness, mask and fabrication process. The tool is not a replacement for electromagnetic analysis, a manufacturing review or prototype qualification.
What thickness and copper weight should I order?
Choose them from the electrical, thermal and mechanical requirements, then confirm the available construction. State dielectric thickness separately from finished board thickness and distinguish starting foil from finished copper. The RF trace-to-ground spacing is especially important for impedance.
What determines lead time?
Material availability, engineering questions, construction complexity, quantity, inspection and delivery location all contribute. Request a confirmed schedule after the files and stackup are reviewed. An online estimate or a generic website lead time is not a commitment for your exact build.
Get a reviewed RO4350B PCB quotation
Send one consistent manufacturing package so that the quotation describes the board you actually intend to build. Include the following information:
- Gerber or agreed fabrication data, NC drill files, outline and revision identifier.
- Quantity, individual-board dimensions, panel requirements and delivery destination.
- Layer stackup, RO4350B core requirements, bonding system and permitted alternatives.
- Finished thickness, copper requirements, controlled nets, impedance targets and tolerances.
- Surface finish, solder-mask notes, inspection requirements and any requested RF measurements.
- Required delivery date and whether you want prototype and production quantities quoted separately.
Include the assumptions used in the calculators. Final pricing and manufacturability are established through file review and the agreed fabrication specification.
Technical references: Rogers Corporation product information and RO4000-series datasheet linked above. Calculators provide preliminary engineering estimates. Product photographs are from the existing RFPCB media archive; AI illustrations are labeled individually. Rogers and RO4350B are trademarks of their respective owner.
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Ready for a quotation?
Send your requirements for a material, stackup and manufacturing review. Price and schedule are confirmed for your project.