RF PCB Applications

APPLICATIONS / START WITH THE SIGNAL

Different RF systems.
Different design priorities.

Find the requirements that matter for your antenna, communication link, sensor or power stage. Connect application intent to material selection, manufacturing review and useful acceptance evidence.

Discuss an application Talk to an engineer

Real RF antenna feed board from the RFPCB archive — Real RF board photograph from the RFPCB archive.

LossBudget the entire signal path

PhaseDefine matching and stability

GeometryControl the critical dimensions

EvidenceAgree what the prototype must prove

Find your application route

antennas

Antenna PCB

Radiation pattern, feed loss and dimensional repeatability. Specify band, feed impedance, substrate thickness and the assembled environment.

RO4003C starting point

Application topic

antennas

Phased-array PCB

Phase matching and amplitude consistency across the feed network. Identify matching groups, reference planes and tolerance budgets.

RO3003 material review

Application topic

wireless

5G and mmWave

Short launches and transitions can dominate the response. Include connectors, RF path length and the required insertion-loss evidence.

Compare RF laminates

Application topic

sensing

77 GHz radar

Control the exact grade, copper and modeled dielectric properties. RO3003 and RO3003G2 require separate material identities.

Review grade distinctions

Application topic

wireless

Base-station boards

Combine RF distribution, power and control circuitry with an agreed material and stackup strategy.

RO4350B guide

Application topic

wireless

Satcom and aerospace

Budget path loss, phase response and environmental requirements together. State the applicable customer qualification requirements.

RT/duroid 5880 guide

Application topic

power

RF power amplifiers

Connect the RF loss model to the thermal path, copper distribution and component attachment requirements.

Review thermal/process scope

Application topic

sensing

Filters and duplexers

Resonance and coupling depend on geometry and tolerances. Define tuning margin, passband and reference planes for verification.

Microwave material guidance

Application topic

wireless

UAV communication links

Balance mass, size, RF path loss and production repeatability. Identify connector, enclosure and environmental constraints.

RF material starting point

Application topic

wireless

RFID, IoT and LoRa

Choose material against the actual antenna and path budget. Cost, size and enclosure effects can matter more than brand preference.

Choose by requirement

Application topic

sensing

Medical RF electronics

Define the electrical function, cleaning/assembly conditions and required qualification evidence. Application use does not imply device certification.

Plan the acceptance evidence

Application topic

sensing

Test and measurement

Repeatability, calibration and fixtures matter alongside the laminate. Document connector launches and measurement reference planes.

Open engineering resources

Application topic

Bring the system context into the PCB brief

Electrical context

State the operating band, critical path length, target impedance, allowable insertion loss and phase error. Include connectors and transitions in the performance boundary. A dielectric loss factor alone cannot describe system performance.

Physical context

Identify enclosure proximity, mounting, connector forces, heat paths and assembly conditions. For an antenna or resonant structure, nearby metal and final assembly geometry can affect the result.

Manufacturing context

Specify exact materials, dielectric tolerances, foil, copper and finish. Discuss hybrid bonding and plated-hole requirements before committing a layout that depends on them.

Acceptance context

Agree which measurements determine acceptance: continuity, impedance, RF loss, phase, antenna response or assembly function. Include fixtures, reference planes and sample conditions.

Prototype with a question in mind

Identify the uncertainty
Is the risk a material model, a launch, a thermal path or a manufacturing tolerance? Define the question before ordering.
Build representative features
Use the production construction and include the feature that controls performance, rather than testing only an easy straight line.
Carry the result into production
Record the approved stackup, measured conditions and revision. Review substitutions against that baseline.

For a broader comparison, use the material selection guide. For processing constraints, review manufacturing capabilities and quality evidence.

Tell us what the board needs to achieve.

Send the operating band, circuit function, critical dimensions and acceptance requirements with your files. A focused brief helps the team review the construction that matters to your system.

Upload files for review Discuss the project first

Related engineering decisions

Ready for a quotation?

Send your requirements for a material, stackup and manufacturing review. Price and schedule are confirmed for your project.

Upload Gerber

Different RF systems.Different design priorities.

Find your application route

Antenna PCB

Phased-array PCB

5G and mmWave

77 GHz radar

Base-station boards

Satcom and aerospace

RF power amplifiers

Filters and duplexers

UAV communication links

RFID, IoT and LoRa

Medical RF electronics

Test and measurement

Bring the system context into the PCB brief

Electrical context

Physical context

Manufacturing context

Acceptance context

Prototype with a question in mind

Identify the uncertainty

Build representative features

Carry the result into production

Tell us what the board needs to achieve.

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Related engineering decisions

Related engineering decisions

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Different RF systems.
Different design priorities.