RF PCB Manufacturing Capabilities

CAPABILITIES / RF FABRICATION TO ASSEMBLY

A process window.
A clear engineering review.

Match your RF board to the right material, construction and test plan. Our shared RFPCB / PCBSync manufacturing operation brings fabrication, assembly and laboratory support into the same project conversation.

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PCB drilling equipment in the shared RFPCB and PCBSync factory — Shared RFPCB / PCBSync facility archive.

Since 2005Shared manufacturing operation

5,000 m²Published Shenzhen facility area

PCB + PCBAFabrication and assembly support

DFM firstReview the actual build before release

Choose the capability your design depends on

Use these process areas to frame the engineering review. The correct combination matters more than selecting the largest number from each specification column.

RF fabrication

High-frequency PCB

Laminate identity, dielectric thickness, copper and RF geometry reviewed as one construction.

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Cost + integration

Hybrid stackups

Place RF material where it matters and review the bonding system, layer balance and transitions.

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Electrical geometry

Controlled impedance

Define line type, target, tolerance, reference plane and coupon requirements before release.

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Layer integration

Multilayer RF boards

Review sequential structures, interconnects and dielectric budgets against the selected materials.

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Mechanical features

Cavities and back-drill

Discuss depth control, residual stubs, registration and the actual signal transition.

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RF interfaces

Edge plating & castellations

Identify the plated edges, grounding path, connector interface and outline tolerances.

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Heat path

Copper and thermal structures

Review copper distribution and thermal paths together with RF loss and mechanical constraints.

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Conductor surface

RF surface finishes

Choose the finish against solderability, contact requirements and the circuit loss model.

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Board to assembly

RF PCB assembly

Add the BOM, placement data, assembly drawing and test scope when the project includes PCBA.

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Manufacturing capability reference

The table below follows the shared factory’s published rigid-PCB process window. It separates mass production from the extended prototype range. These limits are not an automatic promise for every RF laminate or for a design combining several extreme features.

Display capability tier

Parameter	Mass production	Extended prototype	RF engineering condition
Rigid layer count	1–24 layers	1–78 layers	Extended rigid-board range; RF/PTFE stackup approval required.
Line / space	3 / 3 mil	3 / 3 mil	About 0.076 / 0.076 mm; copper and material affect suitability.
Controlled impedance	±10%	±7%	Target, geometry, coupon and measurement method must be agreed.
Copper weight	Up to 4 oz	Up to 12 oz	Not simultaneous with every minimum line/space condition.
Maximum panel	600 × 770 mm	600 × 770 or 500 × 1200 mm	Usable RF area depends on laminate format and process margins.
Maximum board thickness	8.5 mm	8.5 mm	Qualification depends on aspect ratio, material and interconnects.
Published minimum hole	0.1 mm	0.1 mm	Confirm drilled/finished definition, hole type and aspect ratio.
Outline tolerance	±0.15 mm	±0.15 mm	Identify tighter connector or cavity features separately.
PTH / NPTH diameter tolerance	±0.076 / ±0.05 mm	±0.076 / ±0.05 mm	Specify finished dimensions and measurement requirements.

Source: shared factory rigid-PCB capability table, reviewed 24 September 2026. The general capabilities overview lists up to 56 layers; the detailed rigid table lists up to 78 for extended prototypes. Obtain written approval for the specific construction.

For RF and PTFE builds: confirm material thickness, copper foil, hole treatment, bonding system, line geometry, registration, finished tolerance and test coupons together. Availability and a signed-off stackup define the accepted build.

The manufacturing process behind the specification

PCB drilling equipment in the shared manufacturing facility — PCB drilling equipment — factory archive.

Solder mask exposure process in the shared PCB factory — Solder-mask exposure process — factory archive.

PCB materials and process laboratory — Physics and chemistry laboratory — factory archive.

Fabrication control

Imaging, drilling and plating

The shared factory documents LDI, drilling, plating, AOI and electrical-test processes. Request the equipment and process evidence relevant to your critical features.

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Verification

Materials, construction and RF behavior

Microsections, thickness checks and electrical testing answer different questions. Agree additional RF characterization and fixture requirements before ordering.

Define the quality evidence

From fabrication data to a controlled release

For sample wording and a worked approval record, see the RF PCB fabrication notes example. It follows an open RFQ question through supplier proposal, design approval and a consistent manufacturing release.

Submit the actual requirement
Send the revision, Gerber or agreed fabrication format, drill data, outline, stackup and quantity. Add assembly files if PCBA is included.
Resolve engineering questions
Confirm laminate, tolerances, impedance geometry, special features, coupons and any approved substitutions before production release.
Agree acceptance and delivery
Define inspection and test outputs, packaging and schedule in the quotation. Prototype acceptance becomes the baseline for repeat orders.

Is your fabrication package ready for review?

Select what is ready. This checklist runs locally and does not upload files or place an order.

Fabrication files and revisionLayer-by-layer stackup and exact laminateCopper, finish and mechanical tolerancesImpedance targets and required testsQuantity and delivery requirement

Select the items available for review.

Editable review summarySend the summary with your enquiry

Send the difficult part of the design.

A cavity, a hybrid bond, a narrow RF line or a demanding transition: identify the feature that controls the build and include it in your enquiry.

Upload files for review Discuss the project first

Related engineering decisions

Ready for a quotation?

Send your requirements for a material, stackup and manufacturing review. Price and schedule are confirmed for your project.

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RF PCB Manufacturing Capabilities

A process window.A clear engineering review.

Choose the capability your design depends on

High-frequency PCB

Hybrid stackups

Controlled impedance

Multilayer RF boards

Cavities and back-drill

Edge plating & castellations

Copper and thermal structures

RF surface finishes

RF PCB assembly

Manufacturing capability reference

The manufacturing process behind the specification

Imaging, drilling and plating

Materials, construction and RF behavior

From fabrication data to a controlled release

Submit the actual requirement

Resolve engineering questions

Agree acceptance and delivery

Is your fabrication package ready for review?

Send the difficult part of the design.

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Related engineering decisions

Related engineering decisions

In this section

12 Layer RF PCB: Stackup, Materials & Design Guide

16 Layer RF PCB | Phased Array Multilayer Build

2 Layer RF PCB Design: 50 Ohm Microstrip Guide

20 Layer RF PCB | AESA Grade Multilayer Fabrication

4 Layer RF PCB: Stackup, Impedance & Fabrication

40 Layer RF PCB | Maximum Layer Count Design

6 Layer RF PCB Stackup Design & Manufacturing

8 Layer RF PCB | Hybrid Multilayer Fabrication

Automotive RF PCB: Quality and Validation Planning

Back Drilling RF PCB: Stub Removal Guide

Blind Buried Via RF PCB Design Guide

Cavity & Back-Drill PCB

Conformal Coating RF PCB: Effects & Best Practices

Controlled Impedance PCB

Copper Coin PCB | Embedded Thermal Path for RF Power

Depth Control Milling PCB: Process & Design Guide

Edge Launch Connector PCB Design Guide

ENEPIG RF PCB: Finish Guide for Microwave Designs

ENIG RF PCB: Loss, Skin Depth & Finish Guide

Etch Compensation RF PCB: Trace Width Guide

Flexible RF PCB

Gold Finger RF PCB: Step Bevel & Edge Connectors

Hard Gold RF PCB | Wear Resistance & RF Performance

HDI RF PCB Manufacturing

Heavy Copper & Thermal PCB

High Frequency PCB Manufacturing

Hybrid Stackup PCB (Rogers + FR4)

Immersion Silver RF PCB | Lowest-Loss Finish

IPC Class 3 RF PCB | 6012 Class 3 & 3A Guide

ITAR RF PCB: Controlled Data Handling Guide

Laser Drilling RF PCB | 75 µm Microvia on PTFE

Medical RF PCB: Quality, Traceability and Validation

Metal Core RF PCB | Aluminum & Copper Base Guide

Military RF PCB: Procurement and Qualification Requirements

Mixed Dielectric Stackup: Multiple Dk in One Board

Multilayer PTFE PCB: Fusion Bonding Process Guide

Multilayer RF PCB

ODB++ IPC-2581 Gerber: PCB File Format Guide

OSP RF PCB: When to Use It and When to Avoid It

PCB Edge Plating and Castellated Holes

Plasma Treatment PTFE PCB: Activation Guide

Quick Turn RF PCB: Schedule and DFM Planning

RF Cavity PCB: Embedded Component Cavity Design

RF PCB Assembly (PCBA)

RF PCB Depaneling: Router vs Laser for PTFE Boards

RF PCB DFM Review: Files, Checks and Deliverables

RF PCB Impedance Modeling: Inputs and Verification

RF PCB Lamination | PTFE Press Cycle Control

RF PCB Mass Production: Volume Manufacturing Guide

RF PCB Packaging MSL: Floor Life & Dry-Pack Guide

RF PCB Panel Utilization | Cut Rogers Cost 20%

RF PCB Prototype: Low-MOQ Guide for 5–25 Pieces

RF PCB Solder Mask: Impact, Design & Removal

RF PCB Stackup Design: Free Service with Every RFQ

A process window.
A clear engineering review.