Rogers CuClad 217 is a woven-fiberglass-reinforced PTFE circuit laminate. Its construction alternates the orientation of the reinforced plies, providing balanced electrical and mechanical behavior in the board plane. A relatively low proportion of fiberglass supports the grade’s low dielectric constant and loss.
Select the complete construction
CuClad substrates are used for microwave components such as filters, couplers and low-noise amplifier circuits. CuClad 217 is a specific grade within that family; its properties should not be inferred from CuClad 233 or CuClad 250.
Confirm the dielectric option, substrate thickness and copper cladding before completing an impedance calculation. Keep the manufacturer’s test method and frequency with every dielectric value used in the design. Review conductor geometry and the finished circuit response alongside laminate properties.
Confirm fabrication requirements
CuClad 217 is a PTFE-based material. Have the fabricator review the CuClad processing documentation, hole preparation, bonding approach and dimensional tolerances for the proposed board. A thermoset or generic FR-4 material description is inappropriate.
Include the operating band, stackup and inspection requirements in the enquiry. Compare families through the materials directory, or submit the fabrication files using the PCB quote form.
Official sources: Rogers CuClad 217 product information; Rogers CuClad data sheet.
Put this into production
Request a material, stackup and manufacturing review for your RF PCB project.