Rogers CLTE-XT is a high frequency circuit laminate within the CLTE family. Rogers documents the family as ceramic-filled PTFE with woven glass reinforcement. CLTE-XT addresses RF designs where dimensional stability and dielectric behavior over temperature are relevant to circuit performance.
The product is a substrate for printed circuitry, not an enterprise gateway router. It has no operating system, user-management console or network throughput specification. Those claims from the earlier article have been removed.
Compare the exact CLTE-XT construction using current manufacturer data. Specify dielectric thickness and copper, and retain the measurement conditions attached to dielectric constant, dissipation factor and expansion values. Temperature stability of a material does not establish the accuracy or environmental rating of an entire RF assembly.
Use the CLTE processing guidance when planning drilling, hole preparation and lamination. A multilayer design also needs a compatible bonding system and a reviewed thermal cycle. Confirm that electrical models and fabrication drawings refer to the same grade and construction.
Selection and validation
Before releasing a board, record the exact material designation, dielectric thickness, copper foil, finished stackup and inspection requirements. Have the fabricator review the construction and confirm material availability. Prototype measurements should establish whether the finished circuit meets its electrical and environmental requirements.
Official sources: Rogers CLTE-XT product information; CLTE and CLTE-XT data sheet.
Put this into production
Request a material, stackup and manufacturing review for your RF PCB project.