Rogers XtremeSpeed RO1200 is a family of circuit laminates and bondply materials for high-speed PCB designs. The laminate cores use ceramic-filled PTFE with woven glass reinforcement. The companion bondply uses ceramic-filled PTFE without glass reinforcement.
A material system for high-speed circuits
Rogers positions RO1200 for applications where dielectric loss, signal integrity and thermal-mechanical behavior matter, including demanding multilayer designs. The core and bondply are different product forms: a copper-clad core carries circuit layers, while bondply forms dielectric bonding layers within the stackup.
Specify each layer’s material, thickness and copper construction. Do not apply a laminate property to the bondply without checking the corresponding data sheet. The dielectric model, copper roughness, trace geometry and via design should be evaluated together when assessing a channel.
Review the processing route
The RO1200 fabrication guide covers the PTFE core-and-bondply system. Ask the fabricator to review lamination, registration, hole preparation and metallization for the intended layer count. Use the manufacturer’s processing documentation as the starting point for a qualified process.
A manufacturing enquiry should include stackup drawings, target impedance, layer count, board size and test requirements. Explore the PCB materials directory or provide the project files through the PCB quote form for a design-specific review.
Official sources: Rogers RO1200 product page; Rogers RO1200 fabrication guide.
Put this into production
Request a material, stackup and manufacturing review for your RF PCB project.