Rogers SpeedWave 300P is a glass-reinforced prepreg for bonding high frequency and high-speed digital circuit boards. It is an electronic laminate bonding material, not a carbon-fiber structural composite for aircraft parts.
Rogers describes a low-dielectric-constant glass reinforcement and resin system with options for different constructions. The product is used with circuit materials including RO1200, CLTE-MW and RO4000 series laminates. Resin content and glass style influence filling behavior and the resulting dielectric separation.
Specify the prepreg construction, copper pattern density and desired cured thickness. A demanding copper profile may need a different bonding plan from a lightly patterned layer. Check the manufacturer’s storage, handling and press-cycle requirements before using nominal data in a stackup.
Although SpeedWave 300P supports conventional PCB processing approaches, a hybrid multilayer still inherits requirements from its other materials. A PTFE core, for example, needs appropriate surface and hole preparation. Review the complete build instead of treating prepreg compatibility as approval of every possible stackup.
Selection and validation
Before releasing a board, record the exact material designation, dielectric thickness, copper foil, finished stackup and inspection requirements. Have the fabricator review the construction and confirm material availability. Prototype measurements should establish whether the finished circuit meets its electrical and environmental requirements.
Official sources: Rogers SpeedWave 300P; SpeedWave 300P fabrication guide.
Put this into production
Request a material, stackup and manufacturing review for your RF PCB project.