Rogers TC350 is a circuit laminate intended for RF applications that also require heat management. Rogers describes a ceramic-filled PTFE material reinforced with fiberglass. Its role is to provide an insulating substrate for copper circuitry while helping transfer heat through the board construction.
TC350 is a material designation, not a wireless router with network setup options. It should also be distinguished from TC350 Plus and TC600; a similarly named member of the TC family is not automatically an interchangeable replacement.
Review the TC350 data sheet for dielectric properties, thickness and copper configurations. Thermal conductivity is one material property, while device temperature depends on the complete path through copper, vias, interfaces and cooling hardware. Define the anticipated dissipation and boundary conditions before comparing candidate stackups. Because the resin system is PTFE, confirm suitable hole preparation and plating processes instead of relying only on a conventional FR-4 manufacturing plan.
Selection and validation
Before releasing a board, record the exact material designation, dielectric thickness, copper foil, finished stackup and inspection requirements. Have the fabricator review the construction and confirm material availability. Prototype measurements should establish whether the finished circuit meets its electrical and environmental requirements.
Official sources: Rogers TC350 data sheet; Rogers TC series.
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