Rogers DiClad 527 is a woven-fiberglass-reinforced PTFE laminate for high frequency printed circuits. It is not a copper alloy. Copper cladding provides the conductor layer on a circuit laminate; the dielectric material beneath that conductor has a different role and specification.
Within the DiClad family, the fiberglass-to-PTFE ratio is used to obtain different electrical and mechanical characteristics. DiClad 527 uses a higher fiberglass proportion than DiClad 870 and 880. This distinction matters when balancing dimensional behavior with the dielectric properties required by an RF circuit.
Relevant applications include microwave circuitry and antenna structures. Selection should be based on the exact grade, thickness and copper option rather than the family name alone. Compare manufacturer dielectric data using consistent methods and frequencies; avoid combining isolated numbers from different revisions of a product page and data sheet.
The PTFE material system also affects fabrication planning. Drilling, hole activation, plating and multilayer bonding must be reviewed for the intended construction.
Selection and validation
Before releasing a board, record the exact material designation, dielectric thickness, copper foil, finished stackup and inspection requirements. Have the fabricator review the construction and confirm material availability. Prototype measurements should establish whether the finished circuit meets its electrical and environmental requirements.
Official sources: Rogers DiClad 527 product information.
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