August 14, 2023

RO4003C Dielectric Constant: Process and Design Values

Rogers RO4003C is a glass-reinforced hydrocarbon ceramic thermoset laminate used for RF and microwave circuit boards. Its resin system is distinct from PTFE. Correctly identifying the material is the starting point for selecting dielectric data and planning fabrication.

Process Dk and design Dk

The Rogers product page lists a typical process dielectric constant of 3.38 with a tolerance of ±0.05 and a design dielectric constant of 3.55. These labels describe different characterization approaches. They should not be combined into an invented frequency table or treated as interchangeable inputs.

Select a model appropriate to the transmission-line structure and operating band. Record the data-sheet revision and measurement conditions, and include the actual dielectric thickness, copper construction and finished conductor dimensions. Where circuit tolerances are tight, correlate the model with representative test structures.

Fabrication considerations

Rogers describes RO4003C as compatible with standard epoxy/glass PCB processes, without the special through-hole treatment required by traditional PTFE laminates. The board still requires a construction-specific manufacturing review.

Compare substrate families in the RF materials directory, or send the stackup and impedance requirements through the PCB quote form.

Official sources: Rogers RO4003C product information; Rogers RO4000 data sheet.

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