Rogers TMM 10 is a thermoset microwave circuit laminate. The TMM family uses ceramic and hydrocarbon thermoset polymer composites for microstrip and stripline circuits. TMM 10 is a material option for RF designs that need relatively high dielectric constant together with mechanical stability.
Distinguish TMM 10 from TMM 10i
Rogers lists a typical process dielectric constant of 9.20 for TMM 10 and a design value of 9.8. These labels refer to different characterization approaches; they should not be treated as competing measurements or used without their associated conditions. TMM 10i is a separate grade with different published dielectric data.
When assessing TMM 10, calculate the circuit geometry using a suitable material model and the actual dielectric thickness. Review etch tolerances and verify critical filters, matching networks or antenna structures with representative hardware.
Prepare for fabrication
Rogers states that TMM 10 does not require sodium treatment before electroless plating. Its thermoset construction should still be processed using the relevant TMM handling, drilling and routing guidance. The proposed manufacturing flow must suit the finished board and assembly requirements.
Specify the full material grade, copper cladding, thickness and inspection requirements. Compare other options in the RF PCB materials directory, or submit the stackup and fabrication files through the PCB quote form.
Official sources: Rogers TMM 10 product page; Rogers TMM data sheet.
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