Rogers COOLSPAN TECA is a thermally and electrically conductive adhesive film. Its thermosetting epoxy system contains silver filler. It is used for attachments such as a circuit board bonded to a metal backplane, heat sink, metal coin or RF housing.
The material serves an electronic assembly function. It is not packaging stretch film or a pallet-wrapping product. Its electrical conductivity is particularly important when deciding where the adhesive can be placed: it should not be treated as an insulating dielectric bondply.
Review the intended bond area, interface materials, surface preparation and cure requirements. The achievable thermal path and electrical connection depend on the assembled interface, not just the bulk properties of the adhesive. Bond-line thickness, voids and contact geometry deserve attention during process development.
Check clearances to conductors that must remain isolated and define the inspection requirements for the attachment. Validate the cured assembly under its actual temperature excursions and mechanical loading before relying on it for heat removal or grounding.
Selection and validation
Select the exact grade and thickness against the application requirements, then review the current technical data and processing instructions. Material test results describe particular specimens and conditions; they do not establish the performance or approval status of every finished assembly.
Official sources: Rogers COOLSPAN TECA product information.
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