Rogers 2929 bondply is an unreinforced hydrocarbon thermoset adhesive film for bonding multilayer circuit boards. It is a thin bonding material used within an electronic stackup, not plywood or a construction panel.
The material can be considered for RF multilayers and sequential bonding constructions. Its ability to flow around circuit features is relevant to filling spaces around copper and suitable blind-via structures. The selected bonding process still needs to establish that the actual geometry is filled and bonded consistently.
Specify the film thickness, required cured dielectric thickness, copper coverage and layer arrangement. Resin movement during pressing means the starting film thickness is not a universal statement of the final dielectric separation. Review the manufacturer’s cure and handling guidance for the chosen construction.
Electrical suitability must be checked with the circuit stackup. Confirm compatibility with the cores, surface preparation and any subsequent thermal cycles. A published bondply property does not alone determine the impedance, peel integrity or long-term reliability of the finished multilayer board.
Selection and validation
Before releasing a board, record the exact material designation, dielectric thickness, copper foil, finished stackup and inspection requirements. Have the fabricator review the construction and confirm material availability. Prototype measurements should establish whether the finished circuit meets its electrical and environmental requirements.
Official sources: Rogers 2929 bondply; 2929 bondply data sheet.
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