ROLINX CapLink Integrated Capacitor Busbars
Review ROLINX CapLink assemblies for DC-link applications, including capacitor integration and the limits of system-level electrical ratings.
August 10, 2023
Month: August 2023
August 10, 2023
Rogers COOLSPAN TECA Conductive Adhesive Film
Understand COOLSPAN TECA silver-filled epoxy adhesive for thermal and electrical attachment between circuit boards and metal structures.
August 10, 2023
RO4400TM/RO4400TTM Series Bondply
Overview The RO4400TM/RO4400TTM series bondply from Rogers Corporation is a high performance laminate material designed for use in bonding applications. This versatile…
August 10, 2023
CuClad 6250 Bonding Film For High Temperature Applications
Overview of CuClad 6250 Bonding Film CuClad 6250 is a ceramic-filled fluoropolymer composite designed for bonding and sealing applications at high temperatures.…
August 10, 2023
XtremeSpeed RO1200 PCB Laminates and Bondply
Review Rogers XtremeSpeed RO1200 circuit laminates and bondply, including PTFE construction and high-speed PCB stackup considerations.
August 10, 2023
Rogers SpeedWave 300P PCB Bonding Prepreg
Learn how SpeedWave 300P glass-reinforced prepreg is used in RF and high-speed multilayers and which bonding conditions to verify.
August 9, 2023
CuClad 6700 Bonding Film: The Ultimate Guide
Key Characteristics and Applications CuClad 6700 is a high-performance bonding film developed by DuPont for use in the manufacture of multilayer printed…
August 9, 2023
Rogers curamik Endurance: A Superb End-User Solution for Critical Applications
Introduction Rogers curamik Endurance delivers outstanding thermal management and reliability for the most demanding applications in aerospace, defense, telecommunications, energy, medical, and…
August 9, 2023
ROLINX Compact Powder-Coated Busbars
Identify ROLINX Compact power-distribution busbars and review space, insulation, connection and thermal requirements for an assembly.
August 9, 2023
Rogers 2929 Bondply for Multilayer RF Boards
Understand 2929 hydrocarbon thermoset bondply, its role in multilayer circuit bonding and the process details to confirm before fabrication.