Rogers Radix Printable Dielectric is a ceramic-filled, UV-curable polymer developed for photopolymer 3D printing, including stereolithography (SLA) and digital light processing (DLP). The material enables RF dielectric components with shapes that are difficult to produce using conventional laminate fabrication. Rogers describes this material and its intended printing processes on its official Radix product page.
Applications and dielectric design
Applications include antenna lenses, gradient-index (GRIN) structures, impedance-matching components and radome prototypes. A printed lattice can change the local effective dielectric constant by varying the proportion of material and air. Designers must model the complete geometry: the bulk material’s dielectric constant alone does not describe a lattice or determine its antenna performance.
The Radix data sheet describes the 2.8Dk material and reports typical properties with their test conditions. Use the relevant frequency, direction and environmental conditions when comparing those values with another material. A typical data-sheet value is a design reference, not an acceptance specification for every printed part.
Before specifying a printed component
Agree on the resin grade, compatible printer, printing parameters, curing procedure and dimensional inspection with the processing provider. Define the operating frequency, temperature, geometry and RF acceptance measurements. Where the design includes conductors, mounting hardware or PCB connections, review those interfaces and their manufacturing steps separately. Material selection alone does not establish a qualified process for the complete assembly.
For a project combining a printed dielectric component with a conventional circuit board, browse the PCB materials guide. Include the board drawings, stackup and component interface requirements when submitting a PCB quotation request.
Manufacturer references: Rogers Radix overview and Radix Printable Dielectric data sheet.
Put this into production
Request a material, stackup and manufacturing review for your RF PCB project.