
RO4360G2 vs RO3010: Which High-Dk Laminate Fits Your Design?
RO4360G2 is a thermoset, glass-reinforced hydrocarbon laminate with a Dk of 6.15 (10 GHz, 23 °C) and Df of 0.0038, designed for standard FR-4-style processing. RO3010 is a ceramic-filled PTFE laminate with a higher Dk of 10.2 (10 GHz) and Df of 0.0022, but it requires specialized PTFE handling. Choose RO4360G2 when you need a moderate Dk boost with easy fabrication; choose RO3010 when maximum miniaturization or the lowest possible loss at high Dk is the priority and your shop can process PTFE.
Both laminates target the same design goal—shrinking wavelength-dependent structures such as patch antennas, filters, couplers, and delay lines—but they reach that goal through fundamentally different chemistries. The sections below compare every parameter that matters for a board-level decision.
Material Chemistry and Construction

RO4360G2 belongs to the RO4000 family of hydrocarbon ceramic laminates. Its thermoset resin system is loaded with ceramic filler and reinforced with woven glass, giving it mechanical rigidity similar to FR-4. It can be drilled, plated, and laminated on the same equipment used for standard multilayer boards, with no special plasma or sodium-etch surface preparation.
RO3010 is part of the RO3000 series, built on a PTFE matrix filled with ceramic particles. PTFE delivers inherently lower dielectric loss, which is why RO3010 achieves a Df roughly half that of RO4360G2. However, PTFE is soft, has a high coefficient of thermal expansion (CTE) in the Z-axis, and its surface must be chemically or plasma-treated before copper can bond reliably. Fabricators without PTFE experience often reject RO3010 jobs or charge a premium.
Key Parameter Comparison Table
| Parameter | RO4360G2 | RO3010 | Notes |
|---|---|---|---|
| Dk (10 GHz, 23 °C) | 6.15 ± 0.15 | 10.2 ± 0.30 | RO3010 offers ~66 % more miniaturization potential |
| Df (10 GHz, 23 °C) | 0.0038 | 0.0022 | RO3010 lower loss despite higher Dk |
| Resin system | Thermoset hydrocarbon + ceramic | PTFE + ceramic | Drives fabrication differences |
| Reinforcement | Woven glass | None (random ceramic fill) | Glass weave can cause Dk anisotropy in RO4360G2 |
| Z-axis CTE (ppm/°C) | 30 | 17 | RO3010 lower, but PTFE softness complicates via reliability |
| Thermal conductivity (W/m·K) | 0.81 | 0.95 | Both moderate; RO3010 slightly better heat spreading |
| Tg / decomposition | Tg > 280 °C (thermoset) | No true Tg (PTFE) | RO4360G2 is lead-free solder compatible by design |
| Moisture absorption (%) | 0.06 | 0.05 | Both excellent |
| Standard thicknesses (mil / mm) | 6.6, 10, 20, 30, 60 | 5, 10, 25, 50 | 1 mil ≈ 0.0254 mm |
| Copper cladding | ED copper, ½–2 oz | ED copper, ½–2 oz | RO3010 also available with rolled copper |
| Lead-free process compatible | Yes | Yes, with care | PTFE dimensional change during reflow needs profiling |
For the official datasheet values behind this table, see the Rogers RO4360G2 product page.
Dielectric Constant: Stability and Drift
A high Dk is only useful if it stays where you designed it. Both materials are ceramic-loaded, which inherently stabilizes Dk against temperature swings, but the degree of stability differs.
Temperature coefficient of Dk (TCDk)
RO4360G2 has a TCDk of roughly +50 ppm/°C, typical for thermoset hydrocarbon systems. RO3010, benefiting from PTFE’s near-zero TCDk contribution, specifies approximately +38 ppm/°C. Over a 100 °C operating swing (–40 °C to +60 °C), the effective Dk shift in RO3010 is smaller—important for narrowband filters or frequency-sensitive radar front ends.
Use the estimator below to see how much your effective Dk shifts across your operating temperature range for each material. Enter the nominal Dk, TCDk, and your temperature extremes.
For example, with RO3010 at Dk 10.2 and TCDk of 38 ppm/°C over a –40 °C to +85 °C swing (ΔT = 125 °C), the Dk shifts by roughly 0.048—less than 0.5 %. That is tight enough for most coupled-resonator filter designs without trimming. RO4360G2 under the same swing shifts about 0.038 on a lower base Dk of 6.15, proportionally a slightly larger percentage change (~0.6 %). In practice, either material is far more stable than generic FR-4, whose Dk can drift several percent over temperature.
Frequency dependence
Ceramic-filled PTFE laminates like RO3010 exhibit a flatter Dk vs. frequency curve than glass-reinforced thermosets. RO4360G2’s woven-glass reinforcement introduces a periodic dielectric loading that can cause slight Dk variation depending on trace orientation relative to the weave. For designs above 20 GHz, this anisotropy becomes a layout consideration—rotating the board 45° to the weave or using spread-glass variants can help.
Loss Performance
At 10 GHz, RO3010’s Df of 0.0022 gives it a clear loss advantage over RO4360G2’s 0.0038. In practical terms, a 50 Ω microstrip line on 10 mil (0.254 mm) RO3010 at 10 GHz will have roughly 35–40 % lower dielectric loss per unit length than the same line on RO4360G2, all else being equal. Conductor loss (a function of copper roughness and skin depth) is similar for both when using comparable foil grades.
This gap widens with frequency. At 24 GHz or 77 GHz radar bands, the PTFE advantage compounds, making RO3010 the better choice when insertion loss budgets are tight. For designs below 6 GHz—such as GPS patch antennas or sub-6 GHz 5G elements—RO4360G2’s loss is perfectly acceptable, and the fabrication simplicity tips the balance back.
Fabrication and Multilayer Integration
RO4360G2: FR-4-like processing
The single biggest selling point of RO4360G2 is that it processes like epoxy-glass. Standard oxide or oxide-alternative inner-layer treatments work. It bonds well with RO4400 prepregs (available in Dk 3.35 and Dk 6.15 versions) and can be combined with RO4350B or even FR-4 cores in hybrid stackups. Automated optical inspection, mechanical drilling, and standard plating baths all apply without modification.
RO3010: PTFE handling required
RO3010 needs sodium-naphthalenide or plasma etch to activate the PTFE surface before plating or lamination. It is dimensionally less stable during thermal cycling, which can stress plated through-holes. Bonding it into multilayer stackups typically requires RO3000 bondply or a thermoplastic adhesive film. Fabricators experienced with RO3003 and similar PTFE grades will handle RO3010 without issue; others may not.
Hybrid stackup strategy
A common approach in complex RF modules is to use RO3010 only for the antenna or resonator layer where high Dk matters most, and pair it with a hydrocarbon or FR-4 core for digital and power distribution layers. This limits PTFE handling to a single bonding step and keeps overall cost down. RO4360G2, by contrast, integrates seamlessly into all-hydrocarbon multilayers, which simplifies procurement and qualification.
Cost and Availability

RO4360G2 is generally 20–40 % less expensive per panel than RO3010, depending on thickness and order volume. The cost gap widens further at the board level because PTFE fabrication adds process steps (surface preparation, specialized bondply, tighter lamination profiles). Lead times for both are typically 4–8 weeks from Rogers distribution, though RO4360G2 panels are stocked more broadly because the RO4000 family has higher overall demand.
Use the laminate cost index tool below to get a rough relative cost comparison between these and other high-frequency laminates. Select both materials and compare the index values.
If the tool shows RO3010 indexing at roughly 1.5× to 2× the cost of RO4350B, that aligns with market experience. RO4360G2 typically indexes closer to 1.2× to 1.4× of RO4350B. Factor in fabrication surcharges for PTFE and the total board cost difference can reach 2–3× in small-to-medium volumes. For a deeper look at how Rogers pricing compares across brands, see our brand comparison.
Thermal and Mechanical Reliability
RO4360G2’s thermoset resin gives it a defined Tg above 280 °C, making it inherently compatible with lead-free reflow at 260 °C peak. Its Z-axis CTE of 30 ppm/°C is moderate; combined with glass reinforcement, it provides good plated-through-hole reliability through IPC Class 3 thermal cycling per IPC-6012.
RO3010 has no glass transition (PTFE does not cross-link), but it does not decompose until well above 300 °C. Its Z-axis CTE of 17 ppm/°C is lower on paper, yet PTFE’s softness means via barrels can see more stress from in-plane expansion during reflow. Careful via design—smaller aspect ratios, filled or capped vias—mitigates this. For high-reliability applications (aerospace, automotive radar), RO4360G2’s mechanical predictability is often preferred unless RO3010’s electrical performance is non-negotiable.
Application Fit: When to Choose Which
Choose RO4360G2 when:
- You need moderate miniaturization (Dk ~6) with standard PCB processing.
- The design is a multilayer hybrid with digital, power, and RF layers in one stackup.
- Operating frequency is below ~10 GHz and loss budgets are comfortable.
- Cost and lead time are significant constraints.
- Your fabricator does not have PTFE experience.
Choose RO3010 when:
- Maximum size reduction is critical—Dk 10.2 shrinks a patch antenna by ~40 % versus Dk 6.15.
- Low dielectric loss at high Dk is required (narrowband filters, high-Q resonators).
- The design operates above 10 GHz where RO3010’s Df advantage compounds.
- You can isolate the PTFE layer in a hybrid stackup or are building a single-layer antenna.
- Thermal Dk stability over wide temperature swings is paramount (e.g., outdoor base-station antennas).
Design Tips for Both Materials
- Simulate with measured Dk, not nominal. Request Dk/Df characterization data at your operating frequency from Rogers or use their MWI calculator. The 10 GHz datasheet value is a starting point, not a design constant.
- Account for copper roughness. Both laminates are available with standard ED and low-profile foils. At 24 GHz and above, switching to reverse-treated or rolled copper can recover 0.5–1.0 dB/inch of conductor loss. See the RO3010 datasheet for available foil options.
- Watch the ground-plane spacing. High-Dk substrates make traces narrower for a given impedance. A 50 Ω microstrip on 10 mil RO3010 (Dk 10.2) is roughly 9 mil (0.23 mm) wide—tight enough that etching tolerances and copper profile matter. On RO4360G2 (Dk 6.15) the same line is about 14 mil (0.36 mm), giving more manufacturing margin.
- Use full-wave simulation for antenna designs. High-Dk substrates excite surface waves more readily, which can degrade antenna efficiency and distort patterns. Tools like HFSS, CST, or ADS should be used to verify radiation efficiency before committing to a laminate.
- Prototype before volume. Because both materials are specialty grades, validate your stackup with a prototype run. Confirm Dk at your frequency, check impedance, and thermal-cycle test vias before locking in production.
Comparison Summary
| Decision Factor | Winner | Margin |
|---|---|---|
| Higher Dk (more miniaturization) | RO3010 | 10.2 vs 6.15—significant |
| Lower dielectric loss | RO3010 | Df 0.0022 vs 0.0038 |
| Dk thermal stability | RO3010 | Slight edge (lower TCDk) |
| Fabrication ease | RO4360G2 | FR-4-like vs PTFE—large gap |
| Multilayer integration | RO4360G2 | Compatible with standard prepregs |
| Cost (material + fabrication) | RO4360G2 | Often 40–60 % lower total |
| Mechanical reliability | RO4360G2 | Glass reinforcement helps vias |
| Availability | RO4360G2 | Broader stocking, shorter lead time |
For a broader view of how these fit among other high-frequency laminate options, explore our full comparison hub.
Frequently Asked Questions
Can RO4360G2 and RO3010 be used in the same stackup?
Yes, but it requires a compatible bondply—typically a thermoplastic film or RO4400-series prepreg on the RO4360G2 side and RO3000 bondply on the RO3010 side. The different CTEs must be accounted for in the layer count and via design to avoid delamination.
What is the maximum operating frequency for each laminate?
Neither has a hard frequency ceiling. RO3010 is commonly used up to 40 GHz in filter and antenna applications; RO4360G2 is typically deployed up to 10–15 GHz. Above 20 GHz, RO3010’s lower Df and absence of glass-weave effects give it a clear advantage.
Is RO3010 suitable for automotive radar at 77 GHz?
It is electrically capable, but most 77 GHz automotive radar designs favor lower-Dk laminates like RO3003 (Dk 3.0) to keep trace widths manufacturable and reduce surface-wave excitation. RO3010’s Dk of 10.2 makes 77 GHz trace geometries extremely narrow and sensitive to tolerances.
Does RO4360G2 need special prepreg?
Rogers recommends RO4400 prepreg for all-RO4000 multilayers. Using standard FR-4 prepreg in a hybrid stackup is possible for non-critical layers but will change the effective Dk of those dielectric regions, so it must be modeled in the impedance calculation.
How do I get Dk/Df data at my exact frequency?
Rogers publishes Dk/Df vs. frequency curves in their datasheets and offers the free MWI online calculator. For critical designs, request a sample and measure with a split-post dielectric resonator or ring-resonator test coupon at your operating frequency.
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