Month: August 2023

BISCO MF1 Bun Silicone

Overview Silicone bun molding material BISCO MF1 is popular among wig makers and cosplayers for creating realistic-looking hair buns. This durable, reusable…

Rogers RT duroid 5870

BISCO HT-840 Extra-Firm Silicone Foam

A High-Performance Foam for Insulation and Sealing BISCO HT-840 is an extra-firm silicone foam that provides excellent insulation, sealing, vibration dampening and…

Rogers PCB & Material

BISCO HT-820 Firm Silicone Foam

An Excellent Insulation Material for a Variety of Applications BISCO HT-820 is a firm silicone foam that provides excellent thermal insulation and…

Rogers PCB & Material

BISCO HT-800 Medium Silicone Foam

Overview of BISCO HT-800 Foam BISCO HT-800 is a medium density silicone foam designed for insulating and sealing applications. Some key features…

Rogers TMM

BISCO HT-870 Soft Silicone Foam

Key properties and applications of BISCO’s HT-870 foam BISCO HT-870 is a soft, lightweight silicone foam designed for sealing, cushioning, insulating, and…

Rogers RO3003G2

BISCO RS-800 Series Flame Resistant

Key Features of BISCO’s RS-800 FR Series High Flame Resistance for Safety The BISCO RS-800 FR series features flame resistant silicone rubber…

Rogers PCB & Material

BISCO EC2265 Electrically Conductive Epoxy

Introduction BISCO EC2265 is an electrically conductive epoxy designed for electrical and electronics applications requiring conductive bonding, sealing, or potting. It offers…

BISCO BF-1000 Very Soft Silicone Foam

uick Overview The BISCO BF-1000 is a very soft and flexible silicone foam that offers excellent cushioning and vibration dampening properties. It…

RT duroid Laminates

BISCO BF-2000 Ultra Soft Silicone Foam

Overview of the BF-2000 Silicone Foam The BISCO BF-2000 is an ultra soft, lightweight silicone foam designed for a variety of cushioning…

Rogers PCB & Material

Rogers ARLON Ultrapad Press Pads

Introduction The Rogers ARLON Ultrapad Press Pads are a high-performance padding material used in the thermal compression bonding process for multilayer printed…

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