How PCB Panelization Works The panelization process typically follows these steps: Individual PCB designs are created in CAD software The separate designs are arranged in an optimized layout on a larger manufacturing panel Tooling holes, fiducials, test coupons, and break-off tabs are added to the panel The combined panelized design […]

Introduction We are thrilled to announce a significant price reduction for our printed circuit board (PCB) products. As a leading PCB manufacturer, we constantly strive to provide our customers with the highest quality products at competitive prices. In this article, we will discuss the details of our PCB price reduction, […]

Introduction to VIA-PAD VIA-PAD, or Vertically Integrated Array Pad, is an innovative technology that is revolutionizing the world of electronic devices. It is a new type of touchpad that offers superior performance, reliability, and user experience compared to traditional touchpads. VIA-PAD is designed to provide a seamless and intuitive interface […]

What Is Solder Flux? Solder flux is a chemical compound or mixture applied to the surfaces of metals prior to or during the soldering process. Its primary functions are to: Remove oxides and other contaminants from the metal surfaces Prevent oxidation during the soldering process Improve the flow and wetting […]

What Are E-Cigarettes? E-cigarettes, also known as vapes or electronic nicotine delivery systems (ENDS), are battery-powered devices that heat a liquid solution (usually containing nicotine) to create an aerosol that the user inhales. They were first introduced in the mid-2000s as a less harmful alternative to traditional combustible cigarettes. The […]

What is Coverlay Adhesive Squeezeout? Coverlay adhesive squeezeout is a common issue encountered in the manufacturing of flexible printed circuits (FPCs). It occurs when excess adhesive material protrudes from the edges of the coverlay film during the lamination process. This phenomenon can lead to various problems, such as poor aesthetics, […]

Importance of a BOM The BOM is an essential tool for various departments within an organization, including engineering, procurement, manufacturing, and quality control. It plays a vital role in the following areas: 1. Product Development During the product development phase, the BOM helps engineers and designers to: Define the product […]

What is BGA? BGA, or Ball Grid Array, is a type of surface-mount packaging used for integrated circuits (ICs) that utilizes a grid of solder balls as the means of connection between the IC package and the printed circuit board (PCB). This advanced packaging technology has gained significant popularity in […]

What is Panelization? Panelization is the process of arranging multiple printed circuit boards (PCBs) on a single panel for manufacturing. This technique is widely used in PCB fabrication to maximize production efficiency and minimize costs. By grouping several PCBs together, manufacturers can produce a larger number of boards in a […]

Understanding PCB Thickness PCB thickness is typically measured in mils (thousandths of an inch) or millimeters (mm). The most common PCB thicknesses range from 0.8mm to 1.6mm, with 1.6mm being the standard thickness for many applications. However, depending on the specific requirements of your project, you may need to choose […]