Introduction

BISCO EC2265 is an electrically conductive epoxy designed for electrical and electronics applications requiring conductive bonding, sealing, or potting. It offers high electrical and thermal conductivity while maintaining strong adhesive and cohesive strength. Some key features of BISCO EC2265 include:

• Two-part epoxy system for room temperature curing
• High electrical conductivity
• Excellent adhesive strength and thermal shock resistance
• Low volume resistivity
• Simple 1:1 mix ratio by weight or volume

This article provides an overview of BISCO EC2265 and its properties that make it suitable for electrical applications requiring conductive adhesives.

Typical Properties

Here are some of the typical properties of the uncured and cured BISCO EC2265 conductive epoxy:

Property	Value
Color	Silver Grey
Mix Ratio by Weight	1:1
Volume Resistivity (Ω-cm)	0.0004
Thermal Conductivity (W/m-K)	>2
Lap Shear Strength (psi)	1850
Dielectric Constant	5.4
Operating Temperature (°C)	-55 to 200

Applications

EC2265 can be used for various conductive bonding and sealing applications:

Electrical Contacts

The conductive epoxy can be used to bond electrical contacts and connections while maintaining high conductivity. It is often used in relays, connectors, thermal switches, and other contact applications.

EMI/RFI Shielding

The epoxy can provide effective EMI/RFI shielding when applied as a conductive coating or potting compound. It is suitable for aerospace, electronics, and automotive applications requiring EMI/RFI shielding.

Semiconductor and Circuit Assembly

EC2265 can be used as a die-attach or substrate attach adhesive for assembling semiconductors and circuit boards. It provides secure bonds with electrical and thermal conduction.

Potting and Encapsulation

The epoxy can completely encapsulate and pot components and assemblies while providing environmental and moisture protection. It is an effective potting compound for electrical components and circuitry.

Curing

BISCO EC2265 is designed to cure at room temperature after mixing part A resin and part B activator. The epoxy will gel in 16 hours and reach functional strength within 24 hours at 25°C. The epoxy can also be cured more quickly at elevated temperatures up to 121°C.

Handling and Storage

The epoxy resin and activator should be stored frozen at -40°C for maximum shelf life. Allow the components to reach room temperature before use. Unmixed epoxy can be stored for up to one year when kept frozen. Mix containers should be kept tightly closed during use.

Summary

BISCO EC2265 is an electrically conductive epoxy offering high conductivity and strong bonds. Key features include:

• Room temperature or heat cure
• Low resistivity and high thermal conductivity
• Strong adhesive strength and environmental resistance
• Use for electrical contacts, EMI/RFI shielding, die attach, and encapsulation

With its versatile properties, EC2265 is an ideal conductive adhesive for many electronics, aerospace, and electrical applications.

Frequently Asked Questions

Q: What is the shelf life of BISCO EC2265?

A: The shelf life is 1 year when stored frozen at -40°C in unopened containers. Once thawed to room temperature, the working life is 7 days.

Q: Can EC2265 be cured at elevated temperature?

A: Yes, the epoxy can be cured in 2 hours at 80°C or 1 hour at 121°C. Faster heat curing is possible.

Q: Is EC2265 electrically insulative as well as conductive?

A: While highly conductive, EC2265 also functions as an electrical insulator with a high dielectric strength of >350 volts/mil.

Q: Is the epoxy system room temperature stable?

A: Yes, the resin and activator can be stored long term frozen but are stable at room temperature during use and curing.

Q: What metals can EC2265 bond to?

A: It has excellent adhesion to metals including aluminum, copper, gold, silver, nickel, stainless steel, kovar, and others.