PerfecTelTM Circuit Materials

PerfecTelTM circuit materials from Rogers Corporation are widely used in communications systems due to their excellent dielectric properties. These materials have low dissipation factors and tight dielectric constant tolerances, making them ideal for high frequency applications such as 5G infrastructure.

High Frequency Laminates

Rogers’ high frequency laminates like RO4000® and RO3000® series are glass reinforced thermoset materials versatile enough for use in both RF/microwave and high speed digital designs. They have low electrical loss and excellent thermal conductivity for managing heat in high power and high frequency applications. Some popular laminates include:

• RO4003TM – Low cost circuit material, Tg >280°C, εr=3.38.
• RO4350BTM – Low loss, Tg >280°C, εr=3.48. Good for automotive radar systems.
• RO4835TM – Low loss, Tg >280°C, εr=3.33. Ideal for 5G millimeter wave applications.

Microwave Circuit Substrates

Rogers TMM® series of ceramic filled PTFE composites are ideal for microwave components and assemblies. They have stable dielectric constants and low loss over wide frequency ranges. Some examples are:

• TMM3® – Low loss, εr=3.27, df=0.002. Good for Ku/Ka band radomes.
• TMM4® – εr=4.5, low loss. Used in phased array antennas.
• TMM10i® – High thermal conductivity, εr=9.2. Used in high power amplifiers, filters.

Laminate	Dielectric Constant	Loss Tangent	Key Features
RO4003C/RO4003CTM	3.38	0.0021	Low cost, Versatile
RO4835TMTM	3.33	0.0031	Low loss, 5G mmWave
TMM10i®	9.2	0.0020	High εr, Thermal conductivity

Adhesives and Bonding Films

Rogers BONDPLY® and XT/duroid® bonding films are used to bond multilayer PCBs and thermal management materials. Some options are:

• RCBTM – Flexible resin coated copper foil, high bond strength.
• RT/duroid® 6000 – PTFE based film, low loss. Good for mmWave multilayers.
• COOLSPAN® TECA – Thermally conductive adhesive film for bonding heatsinks.

Composites

Rogers curamik® ceramic-filled PTFE composites offer high thermal conductivity and low CTE for thermal management applications:

• CU-W – Copper-tungsten filler, thermal conductivity up to 4W/m-K.
• CU-Mo – Copper-molybdenum filler, thermal conductivity up to 6.5W/m-K.

Applications in Communications Systems

Rogers materials are widely used in wireless infrastructure equipment like:

• 5G mmWave antennas – RO4835TM laminates for phased array antennas and beamswitching networks. RT/duroid® 6000 bonding films for multilayer boards.
• Radar assemblies – RO4350BTM and RO4003CTM laminates have stable dielectric properties for radar housings, antennas and phase shifters.
• Satellite equipment – TMM® series microwave laminates used in filters, oscillators, mixers.
• Base station power amplifiers – TMM10i® and curamik® composites handle high power levels and thermal loads.

Overall, Rogers materials help enable the high frequency, high power and high reliability needs of modern communications systems. Their consistent dielectric properties and low loss help minimize signal loss and distortion in high throughput wireless networks.

Frequently Asked Questions

What are some key properties to look for in PCB materials for communication systems?

Some key properties are:

• Stable dielectric constant over frequency and temperature
• Low loss tangent (dissipation factor)
• Thermal conductivity for power handling
• Low coefficient of thermal expansion (CTE)
• High glass transition temperature (Tg)

How do Rogers PTFE composites compare to ceramics for microwave applications?

Rogers PTFE composites have lower dielectric constants than ceramics, making them preferable for many microwave circuits. They also exhibit lower loss than ceramics at high frequencies. However, ceramics have higher thermal conductivity for power handling.

Which Rogers adhesive is best for bonding aluminum heat sinks to PCBs?

COOLSPAN TECA thermally conductive adhesive works well for bonding aluminum heat sinks. It combines electrical insulation with high thermal conductivity.

Can Rogers materials be used in both RF and digital multilayer PCBs?

Yes, materials like the RO4000® and RO3000® series laminates support both RF and high speed digital. Their low loss helps prevent signal loss and distortion in sensitive RF sections.

What type of Roger’s bonding films are used in mmWave antenna arrays?

RT/duroid® 6000 PTFE bonding films are commonly used. Their low electrical loss helps minimize signal loss across bonded interfaces in phased array antennas at mmWave frequencies.