Introduction

Rogers Corporation’s curamik® division is a global leader in the manufacture of high performance printed circuit board (PCB) substrates. For over 50 years, curamik® ceramic substrates have enabled breakthroughs in industries like telecommunications, automotive, aerospace and defense. In this article, we take a look at curamik’s® Power product line and examine why it is considered the gold standard for high power PCB substrates.

Curamik® Power Substrates

Curamik’s® Power substrates are specifically engineered to meet the demanding needs of high power electronic modules and assemblies. They offer:

• High thermal conductivity
• Excellent electrical insulation
• Superior mechanical strength
• Extreme thermal shock resistance

Some of the key features of curamik® Power substrates include:

Thermal Conductivity

Curamik® Power substrates have thermal conductivity ranging from 60 W/mK to 270 W/mK. This allows efficient dissipation of heat from high power components. Thermal vias and other design optimizations further enhance thermal management.

Dielectric Strength

With dielectric strength exceeding 1kV/25μm, curamik® Power substrates provide excellent electrical insulation between conductors at high voltages. This enables optimal electrical performance.

Mechanical Strength

These substrates have flexural strength up to 450 MPa, ensuring mechanical reliability under thermal cycling and vibration conditions. The high mechanical strength allows fabrication of larger and thinner substrates.

Thermal Shock Resistance

Curamik® Power substrates can reliably withstand extremely high rates of temperature change (>1000°C/min) without cracking or delaminating. This makes them suitable for the harshest operating environments.

Applications

The exceptional material properties of curamik® Power substrates make them the top choice for many high power and high temperature applications:

Power Electronics

Power modules, IGBTs, rectifiers, converters, inverters, motor drives

Automotive

Engine control units, battery management systems, EV/HEV systems

Aerospace

Radar, avionics, engine controls, flight control systems

Industrial

Process controls, robotics, power supplies, generators

Telecommunications

5G base stations, servers, switches, routers

Curamik® Power Substrate Series

Curamik® offers several series of Power substrates to meet application requirements:

Curamik® CERAMBONDTM

CERAMBONDTM substrates feature a next-generation bonding process that joins the copper and ceramic layers. This enables high thermal cycling reliability.

Curamik® DCB

Direct copper bonded (DCB) substrates with excellent thermal conductivity and high temperature capability.

Curamik® AMB

Active metal brazed (AMB) substrates that can operate at extremely high temperatures (>300°C).

Curamik® PowerPlus

PowerPlus substrates have an additional ceramic layer allowing higher amplifier power.

Quality and Reliability

Curamik® has decades of experience developing ceramic substrates for high reliability applications like space, aerospace and defense. Each substrate undergoes rigorous quality control and testing:

• ISO 9001 and AS9100 certified manufacturing
• 100% surface inspection using advanced x-ray technology
• CTE and tolerance testing on each substrate
• Hi-pot testing on finished circuits

This ensures the exceptional quality and reliability that customers have come to expect from curamik® Power substrates.

Conclusion

With industry leading thermal conductivity, electrical insulation, mechanical strength and thermal shock resistance, curamik® Power substrates are the premier solution for high power, high temperature PCB applications. Curamik’s® engineering expertise and rigorous quality processes deliver substrates that enable breakthrough performance while maximizing reliability. As demands on power electronics continue rising, curamik® Power substrates will play an enabling role across industries worldwide.

Frequently Asked Questions

What makes curamik® Power substrates unique?

Curamik® Power substrates offer an unbeatable combination of thermal conductivity, electrical insulation, mechanical strength and thermal shock resistance that sets them apart from conventional PCB substrates. This makes them ideal for high power electronics.

How are curamik® Power substrates manufactured?

They are manufactured using a special co-sintering process that creates an extremely strong bond between the copper and ceramic layers. This process enables curamik’s® exceptional material properties.

What are some common applications of curamik® Power substrates?

Some common applications include power modules, IGBTs, automotive systems like battery management and motor drives, aerospace avionics and radar systems, and 5G telecom hardware.

What testing and quality processes does curamik® use?

Curamik® uses x-ray inspection of 100% of substrate surfaces, CTE and tolerance testing on each substrate, and hi-pot testing on finished circuits. The facilities are ISO and AS9100 certified.

How long has curamik® been making ceramic substrates?

Curamik’s® expertise in ceramic substrate technology spans over 50 years. Their engineering know-how is unmatched in the industry.